Axus Technology delivers advanced process development expertise, equipment, and service support for: -- CMP & Polishing -- Wafer Thinning and Grinding -- Edge Grinding and Profline -- Substrate Cleaning Applications -- Wafer Bonding Applications. Axus' customers range from leading-edge production semiconductor manufacturers through small development facilities. We deliver surface processing solutions to a broad range of technologies, including semiconductor, MEMs device processing, device packaging, TSV/3D Integration, materials processing and development, as well as for virtually any application where material needs to be made flatter, smoother, or thinner. Axus Technology supports a global customer base with a high-quality customer support experience known for delivering high quality, and often highly customized, processes and equipment. The Axus Technology team works with a broad array of substrates and films, applying fundamental and novel process technologies into new product applications.
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